Inventor
Konosuke Hayashi
Inventor
Yokohama, JP
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%
H01LSemiconductor devices30%
B08BCleaning in general12%
F26BDrying solid materials or objects by removing liquid therefrom7%
B05BSpraying apparatus3%
B05CApparatus for applying fluent materials to surfaces, in general3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
B05DProcesses for applying fluent materials to surfaces, in general2%
B23KSoldering or unsoldering2%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein2%
PatentTitleYear
10,607,863Substrate processing apparatus202010,586,727Suction stage, lamination device, and method for manufacturing laminated substrate202010,460,961Substrate processing apparatus201910,406,566Substrate processing device and substrate processing method201910,325,787Substrate processing apparatus and substrate processing method201910,281,210Substrate processing apparatus and substrate processing method201910,276,406Substrate processing device and substrate processing method20199,972,513Device and method for treating a substrate with hydrofluoric and nitric acid20189,966,282Substrate processing apparatus and substrate processing method20189,964,358Substrate processing apparatus and substrate processing method20189,811,096'Liquid feeding device and substrate treating device'20179,795,999'Substrate processing apparatus and substrate processing method'20179,741,596'Bonding apparatus and bonding process method'20179,694,371'Substrate treatment apparatus and substrate treatment method'20179,607,865'Substrate processing device and substrate processing method'20179,586,391'Bonding apparatus and method for manufacturing bonded substrate'20179,553,003'Substrate processing device and substrate processing method'20179,202,724'Substrate treatment apparatus and substrate treatment method'20158,377,251'Spin processing apparatus and spin processing method'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2020Patents assigned to SHIBAURA MECHATRONICS CORP (19)· patent assignee history
2013–2015Patents assigned to HAYASHI KONOSUKE (2)· patent assignee history
2013–2020Based in Yokohama, JP· patent location history
2015Based in Fujisawa, JP· patent location history
2017Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHIBAURA MECHATRONICS CORP | 19 | 2013–2020 |
| HAYASHI KONOSUKEself | 2 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokohama, JP | 17 | 2013–2020 |
| Kanagawa, JP | 1 | 2017 |
| Fujisawa, JP | 1 | 2015 |