Inventor
Lu Velicky
Inventor
Boise, ID, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Fprimary
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
8,669,179'Through-wafer interconnects for photoimager and memory wafers'20148,502,353'Through-wafer interconnects for photoimager and memory wafers'20137,956,443'Through-wafer interconnects for photoimager and memory wafers'20117,683,458'Through-wafer interconnects for photoimager and memory wafers'20107,452,743'Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level'20087,300,857'Through-wafer interconnects for photoimager and memory wafers'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2014Patents assigned to MICRON TECHNOLOGY INC (5)· patent assignee history
2007–2014Based in Boise, ID, US· patent location history
2008Patents assigned to APTINA IMAGING CORP (1)· patent assignee history
2013Patents assigned to AKRAM SALMAN (1)· patent assignee history
2013Patents assigned to FARNWORTH WARREN M (1)· patent assignee history
2013Patents assigned to HEMBREE DAVID R (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 5 | 2007–2014 |
| AKRAM SALMAN | 1 | 2013 |
| APTINA IMAGING CORP | 1 | 2008 |
| FARNWORTH WARREN M | 1 | 2013 |
| HEMBREE DAVID R | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Boise, ID, US | 6 | 2007–2014 |