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Inventor

Cheng-Hsien Hsieh

Inventor
Kaohsiung, TW

Overview

3→
Patents
2009–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01RElectrically-conductive connections17%
H05KPrinted circuits17%
PatentTitleYear
10,950,577Redistribution layers in semiconductor packages and methods of forming same202110,939,551Opening in the pad for bonding integrated passive device in InFO package20217,578,687'Complex coupler for cold cathode fluorescent lamp'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009Patents assigned to SOA TECHNOLOGY CO LTD (1)· patent assignee history
2009Based in Hsinchu County, TW· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2021Based in Kaohsiung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD22021
SOA TECHNOLOGY CO LTD12009
Locations
LocationPatentsSpan
Kaohsiung, TW22021
Hsinchu County, TW12009