Inventor
Kohichi Tanda
Inventor
Shiga, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices22%
C25DProcesses for the electrolytic or electrophoretic production of coatings11%
H02JElectric power networks11%
H05KPrinted circuits11%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
10,069,339Wireless power feeding method and wireless power feeding device20189,018,035'Pressed-contact type semiconductor device and method for manufacturing the same'20158,816,481'Semiconductor device having a porous nickel plating part'20148,093,505'Layered electronic circuit device'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2018Patents assigned to PANASONIC CORP (4)· patent assignee history
2012Patents assigned to GOKAN MANABU (1)· patent assignee history
2012Patents assigned to HIROSE TAKAYUKI (1)· patent assignee history
2012Patents assigned to KASAI YOKO (1)· patent assignee history
2012Patents assigned to NAKAHASHI AKIHISA (1)· patent assignee history
2012–2018Based in Shiga, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PANASONIC CORP | 4 | 2012–2018 |
| GOKAN MANABU | 1 | 2012 |
| HIROSE TAKAYUKI | 1 | 2012 |
| KASAI YOKO | 1 | 2012 |
| NAKAHASHI AKIHISA | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shiga, JP | 4 | 2012–2018 |