Inventor
Karen P. McLaughlin
Inventor
Poughkeepsie, NY, US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
B23KSoldering or unsoldering6%
C25DProcesses for the electrolytic or electrophoretic production of coatings6%
PatentTitleYear
9,947,598Determining crackstop strength of integrated circuit assembly at the wafer level20189,401,336'Dual layer stack for contact formation'20169,214,385'Semiconductor device including passivation layer encapsulant'20158,937,009'Far back end of the line metallization method and structures'20155,985,128'Method of performing processes on features with electricity'19995,935,404'Method of performing processes on features with electricity'19995,896,869'Semiconductor package having etched-back silver-copper braze'19995,869,139'Apparatus and method for plating pin grid array packaging modules'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2018Patents assigned to IBM (8)· patent assignee history
1999–2018Based in Poughkeepsie, NY, US· patent location history
2015Patents assigned to GLOBALFOUNDRIES INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 8 | 1999–2018 |
| GLOBALFOUNDRIES INC | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Poughkeepsie, New York, US | 8 | 1999–2018 |