Inventor
Masayoshi Shinoda
Inventor
Kumagaya, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H05KPrinted circuits27%
H10DInorganic electric semiconductor devices18%
Y10TTechnical subjects covered by former us classification18%
PatentTitleYear
8,557,633'Electronic device and manufacturing method of the same'20137,396,701'Electronic device and manufacturing method of the same'20086,798,072'Flip chip assembly structure for semiconductor device and method of assembling therefor'20046,784,554'Semiconductor device and manufacturing method thereof'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004Patents assigned to HITACHI LTD (2)· patent assignee history
2004Based in Kodaira, JP· patent location history
2004Based in Komoro, JP· patent location history
2008–2013Based in Kumagaya, JP· patent location history
2013Patents assigned to HANADA KENJI (1)· patent assignee history
2013Patents assigned to NAKANISHI MASAKI (1)· patent assignee history
2013Patents assigned to NISHITA TAKAFUMI (1)· patent assignee history
2013Patents assigned to RENESAS ELECTRONICS CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 2 | 2004 |
| HANADA KENJI | 1 | 2013 |
| NAKANISHI MASAKI | 1 | 2013 |
| NISHITA TAKAFUMI | 1 | 2013 |
| RENESAS ELECTRONICS CORP | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kumagaya, JP | 2 | 2008–2013 |
| Kodaira, JP | 1 | 2004 |
| Komoro, JP | 1 | 2004 |