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Inventor

Hua-An Dai

Inventor
Kaohsiung, TW

Overview

2→
Patents
2013
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
8,530,344'Method for manufacturing fine-pitch bumps and structure thereof'20138,501,614'Method for manufacturing fine-pitch bumps and structure thereof'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013Patents assigned to CHIPBOND TECHNOLOGY CORP (2)· patent assignee history
2013Patents assigned to DAI HUA-AN (2)· patent assignee history
2013Patents assigned to HSIEH YUNG-WEI (2)· patent assignee history
2013Patents assigned to LIN CHENG-FAN (2)· patent assignee history
2013Patents assigned to LIN SHU-CHEN (2)· patent assignee history
2013Based in Kaohsiung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHIPBOND TECHNOLOGY CORP22013
DAI HUA-ANself22013
HSIEH YUNG-WEI22013
LIN CHENG-FAN22013
LIN SHU-CHEN22013
Locations
LocationPatentsSpan
Kaohsiung, TW22013