Inventor

Haruhiko Harada

Inventor

Takasaki, JP

Overview

5→

Patents

2012–2018

Patent span

Electricity

Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%

H01LSemiconductor devices19%

B29CShaping or joining of plastics13%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts13%

PatentTitleYear

9,966,329Method for manufacturing semiconductor device2018 9,960,055Manufacturing method of semiconductor device2018 9,887,105'Manufacturing method of semiconductor device'2018 8,435,867'Method of manufacturing semiconductor device and method of manufacturing electronic device'2013 8,105,878'Manufacturing method of a semiconductor device having a package dicing'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2018Patents assigned to RENESAS ELECTRONICS CORP (5)· patent assignee history

2012–2013Patents assigned to HARADA HARUHIKO (2)· patent assignee history

2012Patents assigned to MATSUURA TAKAO (1)· patent assignee history

2012–2013Based in Nanae, JP· patent location history

2013Patents assigned to FUJISHIMA ATSUSHI (1)· patent assignee history

2018Based in Takasaki, JP· patent location history

2018Based in Gunma, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
RENESAS ELECTRONICS CORP	5	2012–2018
HARADA HARUHIKOself	2	2012–2013
FUJISHIMA ATSUSHI	1	2013
MATSUURA TAKAO	1	2012

Locations

Location	Patents	Span
Takasaki, JP	2	2018
Nanae, JP	2	2012–2013
Gunma, JP	1	2018