Inventor
Sujatha Sankaran
Inventor
Wappingers Falls, NY, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
B82YSpecific uses or applications of nanostructures11%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
H10DInorganic electric semiconductor devices6%
B65BMachines, apparatus or devices for, or methods of, packaging articles or materials2%
G05BControl or regulating systems in general2%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes2%
H02JElectric power networks2%
Y04SSystems integrating technologies related to power network operation, communication or information technologies for improving the electrical power generation, transmission, distribution, management or usage, i.e. smart grids2%
PatentTitleYear
11,077,966Method of bagging mass-fabricated custom items202110,895,855Controlling devices using a rich representation of their environment20218,343,868'Device and methodology for reducing effective dielectric constant in semiconductor devices'20138,298,948'Capping of copper interconnect lines in integrated circuit devices'20128,129,286'Reducing effective dielectric constant in semiconductor devices'20128,056,039'Interconnect structure for integrated circuits having improved electromigration characteristics'20117,968,456'Method of forming an embedded barrier layer for protection from chemical mechanical polishing process'20117,947,907'Electronics structures using a sacrificial multi-layer hardmask scheme'20117,892,940'Device and methodology for reducing effective dielectric constant in semiconductor devices'20117,776,737'Reliability of wide interconnects'20107,737,528'Structure and method of forming electrically blown metal fuses for integrated circuits'20107,671,362'Test structure for determining optimal seed and liner layer thicknesses for dual damascene processing'20107,645,700'Dry etchback of interconnect contacts'20107,592,685'Device and methodology for reducing effective dielectric constant in semiconductor devices'20097,488,679'Interconnect structure and process of making the same'20097,405,147'Device and methodology for reducing effective dielectric constant in semiconductor devices'20087,394,154'Embedded barrier for dielectric encapsulation'20087,371,684'Process for preparing electronics structures using a sacrificial multilayer hardmask scheme'20087,323,410'Dry etchback of interconnect contacts'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2013Patents assigned to IBM (17)· patent assignee history
2008–2013Based in Wappingers Falls, NY, US· patent location history
2009–2011Based in New Paltz, NY, US· patent location history
2012–2013Patents assigned to SANKARAN SUJATHA (3)· patent assignee history
2012–2013Patents assigned to SIMON ANDREW H (3)· patent assignee history
2012–2013Patents assigned to COLBURN MATTHEW E (2)· patent assignee history
2012–2013Patents assigned to COONEY III EDWARD C (2)· patent assignee history
2012Based in Hopewell Junction, NY, US· patent location history
2021Based in Granite Bay, CA, US· patent location history
2021Based in Redmond, WA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 17 | 2008–2013 |
| SANKARAN SUJATHAself | 3 | 2012–2013 |
| SIMON ANDREW H | 3 | 2012–2013 |
| COLBURN MATTHEW E | 2 | 2012–2013 |
| COONEY III EDWARD C | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Wappingers Falls, New York, US | 11 | 2008–2013 |
| New Paltz, New York, US | 5 | 2009–2011 |
| Granite Bay, California, US | 1 | 2021 |
| Redmond, Washington, US | 1 | 2021 |
| Hopewell Junction, New York, US | 1 | 2012 |