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Inventor

Wei-Wen Tsai

Inventor
Newark, DE, US

Overview

3→
Patents
2000–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B08Bprimary
B08BCleaning in general20%
B23KSoldering or unsoldering20%
B24BMachines, devices, or processes for grinding or polishing20%
C09GPolishing compositions20%
G06KGraphical data reading20%
PatentTitleYear
10,947,415Chemical mechanical polishing of tungsten using a method and composition containing quaternary phosphonium compounds20218,685,168'Method for removing micro-debris and device of the same'20146,021,948'Hybrid card readers for IC cards/magnetic cards'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2014Patents assigned to IND TECH RES INST (2)· patent assignee history
2000Patents assigned to ALSTON DEV CO LTD (1)· patent assignee history
2000Based in Tainan, TW· patent location history
2014Patents assigned to CHENG CHUNG-WEI (1)· patent assignee history
2014Based in Hsinchu, TW· patent location history
2021Patents assigned to ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC (1)· patent assignee history
2021Patents assigned to ROHM AND HAAS ELECTRONIC MAT CMP HOLDINGS (1)· patent assignee history
2021Based in Newark, DE, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IND TECH RES INST22000–2014
ALSTON DEV CO LTD12000
CHENG CHUNG-WEI12014
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC12021
ROHM AND HAAS ELECTRONIC MAT CMP HOLDINGS12021
Locations
LocationPatentsSpan
Newark, Delaware, US12021
Hsinchu, TW12014
Tainan, TW12000