Inventor
Shrikar Bhagath
Inventor
San Jose, CA, US
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
H01LSemiconductor devices11%
G06KGraphical data reading9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
G11CStatic stores7%
H05KPrinted circuits7%
H10BElectronic memory devices5%
H10DInorganic electric semiconductor devices5%
B24BMachines, devices, or processes for grinding or polishing2%
LOC142%
PatentTitleYear
11,094,674Memory scaling semiconductor device202111,011,500Memory scaling semiconductor device202110,290,354Partial memory die201910,128,218Semiconductor device including die bond pads at a die edge20189,064,836'Extrinsic gettering on semiconductor devices'20158,852,999'System-in-a-package based flash memory card'20148,637,978'System-in-a-package based flash memory card'20148,575,724'Semiconductor device having under-filled die in a die stack'20138,470,640'Method of fabricating stacked semiconductor package with localized cavities for wire bonding'20138,432,043'Stacked wire bonded semiconductor package with low profile bond line'20138,294,251'Stacked semiconductor package with localized cavities for wire bonding'20128,241,953'Method of fabricating stacked wire bonded semiconductor package with low profile bond line'20128,022,519'System-in-a-package based flash memory card'20117,967,184'Padless substrate for surface mounted components'20117,816,181'Method of under-filling semiconductor die in a die stack and semiconductor device formed thereby'20107,795,715'Leadframe based flash memory cards'20107,791,191'Semiconductor device having multiple die redistribution layer'20107,560,304'Method of making a semiconductor device having multiple die redistribution layer'20097,495,255'Test pads on flash memory cards'20097,488,620'Method of fabricating leadframe based flash memory cards including singulation by straight line cuts'20097,485,501'Method of manufacturing flash memory cards'20097,259,028'Test pads on flash memory cards'2007D0548740'SIP based flash memory card'20076,512,675'Heat sink grounded to a grounded package lid'20036,229,219'Flip chip package compatible with multiple die footprints and method of assembling the same'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2021Based in San Jose, CA, US· patent location history
2007–2011Patents assigned to SANDISK CORP (10)· patent assignee history
2011–2014Patents assigned to SANDISK TECHNOLOGIES INC (8)· patent assignee history
2012–2015Patents assigned to BHAGATH SHRIKAR (8)· patent assignee history
2012–2014Patents assigned to TAKIAR HEM (7)· patent assignee history
2019–2021Patents assigned to SANDISK TECHNOLOGIES LLC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SANDISK CORP | 10 | 2007–2011 |
| BHAGATH SHRIKARself | 8 | 2012–2015 |
| SANDISK TECHNOLOGIES INC | 8 | 2011–2014 |
| TAKIAR HEM | 7 | 2012–2014 |
| SANDISK TECHNOLOGIES LLC | 3 | 2019–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 25 | 2001–2021 |