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Inventor

Kuan-Wei Su

Inventor
Kaohsiung, TW

Overview

3→
Patents
2019–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices23%
H10BElectronic memory devices23%
H10DInorganic electric semiconductor devices23%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
10,699,960Methods for improving interlayer dielectric layer topography202010,672,777Method of manufacturing semiconductor device having multi-height structure202010,211,214Semiconductor device having milti-height structure and method of manufacturing the same2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
2019–2020Based in Kaohsiung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD32019–2020
Locations
LocationPatentsSpan
Kaohsiung, TW32019–2020