Inventor
YUNG-SHENG LIN
Inventor
TW
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H01LSemiconductor devices25%
G06FElectric digital data processing8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
C25DProcesses for the electrolytic or electrophoretic production of coatings4%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry3%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems3%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%
H10DInorganic electric semiconductor devices3%
B01DSeparation1%
PatentTitleYear
12,566,472Systems and methods for managing settings based upon information handling system (IHS) posture and orientation using heterogeneous computing platforms202612,547,783Privacy threat detection with extended field of view202612,543,552Semiconductor device structure with conductive bumps202612,500,149Semiconductor device and method of forming the same202512,463,166Chip structure and method for forming the same202512,438,048Redistribution lines with protection layers and method forming same202512,431,365Bump structure and method of making the same202512,412,858Semiconductor device structure with conductive bumps202512,333,314Systems and methods for configuration of a workspace based on short-range wireless location mapping in heterogeneous computing platforms202512,141,519Systems and methods for managing text settings based upon user distance with heterogeneous computing platforms202412,109,669Pipe plier structure202412,064,754Titanium catalyst and synthesizing polyester resins202412,057,670Semiconductor package structure and method for manufacturing the same202412,033,870Bump structure and method of making the same202412,015,002Chip structure and method for forming the same202412,009,256Redistribution lines with protection layers and method forming same202411,994,787Method and apparatus for closed-loop camera shutter control and remediation hardware202411,990,440Structure and formation method of semiconductor device with conductive bumps202411,854,964Structure and formation method of semiconductor device with conductive bumps202311,798,907Semiconductor packages202311,769,716Semiconductor device and methods of forming the same202311,721,579Redistribution lines with protection layers and method forming same202311,669,639System and method for multi-user state change202311,430,761Semiconductor package and method for manufacturing the same202211,417,539Bump structure and method of making the same202211,387,143Redistribution lines with protection layers and method forming same202211,257,776Semiconductor package structure and method for manufacturing the same202211,180,607Polyesters with ultra-high flowability and superior stability and meltblown fibers thereof2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to CHANG CHUN PLASTICS CO LTD (2)· patent assignee history
2021–2026Based in TW· patent location history
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (15)· patent assignee history
2022–2024Patents assigned to ADVANCED SEMICONDUCTOR ENG (4)· patent assignee history
2023–2026Patents assigned to DELL PRODUCTS LP (6)· patent assignee history
2024Patents assigned to CHANG CHUN PETROCHEMICAL CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 15 | 2022–2026 |
| DELL PRODUCTS LP | 6 | 2023–2026 |
| ADVANCED SEMICONDUCTOR ENG | 4 | 2022–2024 |
| CHANG CHUN PLASTICS CO LTD | 2 | 2021–2024 |
| CHANG CHUN PETROCHEMICAL CO LTD | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 28 | 2021–2026 |