Inventor
RODNEY IVAN MARTENS
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Rprimary
H01RElectrically-conductive connections25%
H01BCables17%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%
C08LCompositions of macromolecular compounds8%
C23CCoating metallic material8%
C25DProcesses for the electrolytic or electrophoretic production of coatings8%
H01PWaveguides8%
H05KPrinted circuits8%
Y10TTechnical subjects covered by former us classification8%
PatentTitleYear
12,351,936Layered plating stack for improved contact resistance in corrosive environments202512,160,061Metal composite for use with separable electrical interfaces202411,843,153Use of enhanced performance ultraconductive copper materials in cylindrical configurations and methods of forming ultraconductive copper materials202311,183,787Electrical connector and connector system having plated ground shields202111,152,729Electrical connector and electrical connector assembly having a mating array of signal and ground contacts2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to TE Connectivity Services Gmbh (4)· patent assignee history
2021Patents assigned to TE CONNECTIVITY CORP (2)· patent assignee history
2021–2024Based in US· patent location history
2023–2025Patents assigned to TE CONNECTIVITY SOLUTIONS GMBH (3)· patent assignee history
2025Based in SG· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TE Connectivity Services Gmbh | 4 | 2021–2024 |
| TE CONNECTIVITY SOLUTIONS GMBH | 3 | 2023–2025 |
| TE CONNECTIVITY CORP | 2 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 4 | 2021–2024 |
| SG | 1 | 2025 |