Inventor
Li-ling LIAO
Inventor
TW
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
H10KOrganic electric solid-state devices7%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
12,538,852Package structure containing chip structure with inclined sidewalls202612,519,067Two-piece type stiffener structure with beveled surface for delamination reduction and methods for forming the same202612,482,780Chip package structure including an underfill material portion comprising a cut region202512,476,203Stiffener structure with beveled sidewall for footprint reduction and methods for forming the same202512,431,415Buffer block structures for C4 bonding and methods of using the same202512,347,764Organic interposer including intra-die structural reinforcement structures and methods of forming the same202512,261,102Semiconductor package and method of forming the same202512,176,301Package structure and method for forming the same202412,113,033Chip package structure202412,040,267Organic interposer including intra-die structural reinforcement structures and methods of forming the same202412,014,969Package structure and method for forming the same202411,978,722Structure and formation method of package containing chip structure with inclined sidewalls202411,728,284Chip package structure and method for forming the same202311,705,406Package structure and method for forming the same202311,610,835Organic interposer including intra-die structural reinforcement structures and methods of forming the same2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (15)· patent assignee history
2023–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 15 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 15 | 2023–2026 |