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Inventor

HUI-LING CHUANG

Inventor
TW

Overview

2→
Patents
2023
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10BElectronic memory devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
11,765,881Semiconductor structure with capacitor landing pad and method of making the same202311,563,012Semiconductor structure with capacitor landing pad and method of making the same2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023Patents assigned to FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD (2)· patent assignee history
2023Patents assigned to UNITED MICROELECTRONICS CORP (2)· patent assignee history
2023Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD22023
UNITED MICROELECTRONICS CORP22023
Locations
LocationPatentsSpan
TW22023