Inventor
Minoru Ueshima
Inventor
Matsudo, JP
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering24%
C22CAlloys19%
H05KPrinted circuits16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H01LSemiconductor devices8%
Y10TTechnical subjects covered by former us classification4%
B22FWorking metallic powder2%
H01BCables2%
H10HInorganic light-emitting semiconductor devices having potential barriers2%
Y02PClimate change mitigation technologies in the production or processing of goods2%
PatentTitleYear
11,024,598Metallic sintered bonding body and die bonding method202110,968,932Soldered joint and method for forming soldered joint202110,658,107Method of manufacturing permanent magnet202010,354,944Method for soldering surface-mount component and surface-mount component201910,297,539Electronic device including soldered surface-mount component201910,272,527Solder alloy, and LED module201910,265,807Solder alloy and module201910,090,268Method of forming solder bump, and solder bump20189,807,889'Method of mounting electronic component to circuit board'20179,796,053'High-temperature lead-free solder alloy'20179,487,846'Electroconductive bonding material'20169,227,258'Lead-free solder alloy having reduced shrinkage cavities'20169,205,513'Bi—Sn based high-temperature solder alloy'20159,185,812'Lead-free solder paste'20159,162,324'Solder paste and solder joint'20158,975,757'Lead-free solder connection structure and solder ball'20158,888,932'Indium-containing lead-free solder for vehicle-mounted electronic circuits'20148,865,062'High-temperature lead-free solder alloy'20148,845,826'Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder'20148,790,472'Process for producing a solder preform having high-melting metal particles dispersed therein'20148,343,383'Anisotropic conductive material'20138,334,598'Power semiconductor device and manufacturing method therefor'20128,303,735'Lead-free low-temperature solder'20128,216,395'Lead-free solder alloy'20127,800,230'Solder preform and electronic component'20107,682,468'Lead-free solder alloy'20107,628,308'Method of replenishing an oxidation suppressing element in a solder bath'20097,537,728'Method for increasing the effectiveness of a component of a material'20097,451,805'Pouring apparatus for molten metal and casting method'20087,338,567'Lead-free solder alloy'20087,282,175'Lead-free solder'20077,029,542'Lead-free solder alloy'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2021Patents assigned to SENJU METAL INDUSTRY CO (32)· patent assignee history
2006–2010Based in Misato, JP· patent location history
2008–2018Based in Matsudo, JP· patent location history
2012–2019Patents assigned to UESHIMA MINORU (14)· patent assignee history
2012–2015Patents assigned to OHNISHI TSUKASA (2)· patent assignee history
2012–2021Based in Tokyo, JP· patent location history
2014–2016Patents assigned to KAWAMATA YUJI (3)· patent assignee history
2014Patents assigned to MATSUSHITA KAZUHIRO (2)· patent assignee history
2019–2020Based in Chiba, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SENJU METAL INDUSTRY CO | 32 | 2006–2021 |
| UESHIMA MINORUself | 14 | 2012–2019 |
| KAWAMATA YUJI | 3 | 2014–2016 |
| MATSUSHITA KAZUHIRO | 2 | 2014 |
| OHNISHI TSUKASA | 2 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Matsudo, JP | 14 | 2008–2018 |
| Tokyo, JP | 10 | 2012–2021 |
| Misato, JP | 5 | 2006–2010 |
| Chiba, JP | 3 | 2019–2020 |