Inventor
Jau-Shoung Chen
Inventor
Hsinchu County, TW
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1062%
H05KPrinted circuits14%
B23KSoldering or unsoldering8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
C23FNon-mechanical removal of metallic material from surface3%
C25FProcesses for the electrolytic removal of materials from objects3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
8,059,422'Thermally enhanced package structure'20117,614,888'Flip chip package process'20097,538,421'Flip-chip package structure with stiffener'20097,064,428'Wafer-level package structure'20066,989,326'Bump manufacturing method'20066,967,153'Bump fabrication process'20056,939,790'Wafer bumping process with solder balls bonded to under bump metallurgy layer formed over active surface by forming flux on solder ball surfaces and reflowing the solder'20056,927,964'Structure for preventing burnt fuse pad from further electrical connection'20056,908,842'Bumping process'20056,877,653'Method of modifying tin to lead ratio in tin-lead bump'20056,875,683'Method of forming bump'20056,861,346'Solder ball fabricating process'20056,846,719'Process for fabricating wafer bumps'20056,827,252'Bump manufacturing method'20046,756,256'Method for preventing burnt fuse pad from further electrical connection'20046,743,707'Bump fabrication process'20046,732,912'Solder ball attaching process'20046,723,630'Solder ball fabrication process'20046,720,244'Bump fabrication method'20046,716,739'Bump manufacturing method'20046,713,320'Bumping process'20046,673,711'Solder ball fabricating process'20046,664,128'Bump fabrication process'20036,617,237'Lead-free bump fabrication process'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2011Patents assigned to ADVANCED SEMICONDUCTOR ENG (24)· patent assignee history
2003–2011Based in Hsinchu County, TW· patent location history
2004Based in Hsinchu, TW· patent location history
2005Based in Jubei, TW· patent location history
2011Patents assigned to ASE ELECTRONICS INC (1)· patent assignee history
2011Patents assigned to CHAO SHIN-HUA (1)· patent assignee history
2011Patents assigned to CHEN JAU-SHOUNG (1)· patent assignee history
2011Patents assigned to HUANG TAI-YUAN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 24 | 2003–2011 |
| ASE ELECTRONICS INC | 1 | 2011 |
| CHAO SHIN-HUA | 1 | 2011 |
| CHEN JAU-SHOUNGself | 1 | 2011 |
| HUANG TAI-YUAN | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu County, TW | 20 | 2003–2011 |
| Jubei, TW | 2 | 2005 |
| Hsinchu, TW | 2 | 2004 |