LexDanaLexDanabeta
Inventor

Devika SIL

Inventor
US

Overview

4→
Patents
2022–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
B05DProcesses for applying fluent materials to surfaces, in general7%
C23CCoating metallic material7%
H10BElectronic memory devices7%
H10NElectric solid-state devices not otherwise provided for7%
PatentTitleYear
12,272,545Embedded metal contamination removal from BEOL wafers202511,756,786Forming high carbon content flowable dielectric film with low processing damage202311,309,216Large grain copper interconnect lines for MRAM202211,302,637Interconnects including dual-metal vias2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to IBM (4)· patent assignee history
2022–2025Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM42022–2025
Locations
LocationPatentsSpan
US42022–2025