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Inventor

Hiroshi Horibe

Inventor
Tokyo, JP

Overview

2→
Patents
2016–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B62Dprimary
B62DMotor vehicles25%
H01LSemiconductor devices25%
H05KPrinted circuits25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
PatentTitleYear
10,978,420Semiconductor chip mounting apparatus and semiconductor chip mounting method20219,283,995'Vehicle front structure'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016Patents assigned to HONDA MOTOR CO LTD (1)· patent assignee history
2016Based in Wako, JP· patent location history
2021Patents assigned to SHINKAWA KK (1)· patent assignee history
2021Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HONDA MOTOR CO LTD12016
SHINKAWA KK12021
Locations
LocationPatentsSpan
Tokyo, JP12021
Wako, JP12016