Inventor
HIROSHI MAWATARI
Inventor
JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices22%
H05KPrinted circuits22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%
C23CCoating metallic material6%
C25DProcesses for the electrolytic or electrophoretic production of coatings6%
PatentTitleYear
12,119,293Through electrode substrate and mounting substrate202412,028,972Wiring board and manufacturing method of the wiring board202411,810,820Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate202311,373,906Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to DAINIPPON PRINTING CO LTD (4)· patent assignee history
2022–2024Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DAINIPPON PRINTING CO LTD | 4 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2022–2024 |