Inventor

CHENG-MING WU

Inventor
TW

Overview

23→
Patents
2021–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 23 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Fprimary
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation36%
H01LSemiconductor devices27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
H04NPictorial communication, e.g. television8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
G01SRadio direction-finding3%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
G06FElectric digital data processing2%
G06VImage or video recognition or understanding2%
H02SGeneration of electric power by conversion of infrared radiation, visible light or ultraviolet light, e.g. using photovoltaic [pv] modules2%
PatentTitleYear
12,593,147Structures and methods for phase detection auto focus202612,575,198Vertically arranged semiconductor pixel sensor202612,520,521Method of forming high voltage transistor and structure resulting therefrom202612,471,408Semiconductor structure and method of manufacturing the same202512,457,812Semiconductor structure and method of manufacturing the same202512,446,338Method for manufacturing image sensor including forming FinFET transfer gate having a plurality of channel fins above a p-type region202512,408,464Semiconductor arrangement with isolation structure202512,396,285Integration of solar cell and image sensor202512,386,073Pixel array including time-of-flight sensors202512,277,795Optical fingerprint sensor with enhanced anti-counterfeiting features202512,255,217Semiconductor device, semiconductor image sensor, and method of manufacturing the same202512,243,894Stacked image sensors and methods of formation202512,166,048Pixel array including octagon pixel sensors202412,164,034Pixel array including time-of-flight sensors202412,142,630Vertically arranged semiconductor pixel sensor202412,051,659Semiconductor devices having conductive pad structures with multi-barrier films202412,051,704Pixel array including octagon pixel sensors202412,021,105Pixel array including octagon pixel sensors202411,837,619Semiconductor arrangement with isolation structure202311,688,703Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films202311,670,651Pixel array including octagon pixel sensors202311,309,265Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films202211,144,690Extensible layer mapping for in-design verification2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021Patents assigned to SYNOPSYS INC (1)· patent assignee history
2021–2026Based in TW· patent location history
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (22)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD222022–2026
SYNOPSYS INC12021
Locations
LocationPatentsSpan
TW232021–2026