Inventor
Michael S. Wisnieski
Inventor
O'Fallon, MO, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing31%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
B01FMixing, e.g. dissolving, emulsifying or dispersing8%
B24DTools for grinding, buffing or sharpening8%
G01BMeasuring length, thickness or similar linear dimensions8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
Y10TTechnical subjects covered by former us classification8%
PatentTitleYear
7,186,629'Protecting thin semiconductor wafers during back-grinding in high-volume production'20076,672,943'Eccentric abrasive wheel for wafer processing'20046,632,012'Mixing manifold for multiple inlet chemistry fluids'20035,787,595'Method and apparatus for controlling flatness of polished semiconductor wafer'19985,571,373'Method of rough polishing semiconductor wafers to reduce surface roughness'19965,422,316'Semiconductor wafer polisher and method'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–1996Patents assigned to MEMC ELECTRONIC MATERIALS (2)· patent assignee history
1995–1998Based in O'Fallon, MO, US· patent location history
1998Patents assigned to MEMC ELECTRIC MATERIALS INC (1)· patent assignee history
2003–2004Patents assigned to WAFER SOLUTIONS INC (2)· patent assignee history
2003–2004Based in Pleasanton, CA, US· patent location history
2007Patents assigned to ADVANCED MATERIALS SCIENCES IN (1)· patent assignee history
2007Based in Keizer, OR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MEMC ELECTRONIC MATERIALS | 2 | 1995–1996 |
| WAFER SOLUTIONS INC | 2 | 2003–2004 |
| ADVANCED MATERIALS SCIENCES IN | 1 | 2007 |
| MEMC ELECTRIC MATERIALS INC | 1 | 1998 |
Locations
| Location | Patents | Span |
|---|---|---|
| O'Fallon, MO, US | 3 | 1995–1998 |
| Pleasanton, California, US | 2 | 2003–2004 |
| Keizer, OR, US | 1 | 2007 |