Inventor

Kengo Hirayama

Inventor
Tokyo, JP

Overview

3→
Patents
2010–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics13%
B29DProducing particular articles from plastics or from substances in a plastic state13%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts13%
B29LIndexing scheme associated with subclass b29c, relating to particular articles13%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds13%
G02BOptical elements, systems or apparatus13%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests13%
G06KGraphical data reading6%
G06VImage or video recognition or understanding6%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010–2013Patents assigned to HOYA CORP (2)· patent assignee history
2010–2021Based in Tokyo, JP· patent location history
2013Patents assigned to HIRAYAMA KENGO (1)· patent assignee history
2013Patents assigned to HOSHI YUJI (1)· patent assignee history
2013Patents assigned to KADOTA MASANORI (1)· patent assignee history
2013Patents assigned to KITAHARA YOSHITAKA (1)· patent assignee history
2013Based in Bangkok, TH· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HOYA CORP22010–2013
HIRAYAMA KENGOself12013
HOSHI YUJI12013
KADOTA MASANORI12013
KITAHARA YOSHITAKA12013
Locations
LocationPatentsSpan
Tokyo, JP22010–2021
Bangkok, TH12013