Inventor
SUNGEUN JO
Inventor
KR
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H05KPrinted circuits18%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation9%
PatentTitleYear
12,520,455System, apparatus, and method with immersion cooling202612,506,047Semiconductor package and cooling system202512,431,403Semiconductor package including thermal interface material (TIM) layers on semiconductor chips202512,388,048Semiconductor package comprising heat spreader202511,393,859Image sensor package2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (5)· patent assignee history
2022–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 5 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 5 | 2022–2026 |