Inventor
Ross W. Keesler
Inventor
Endicott, NY, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits45%
Y10TTechnical subjects covered by former us classification32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
H01RElectrically-conductive connections2%
PatentTitleYear
7,353,590'Method of forming printed circuit card'20087,351,917'Vents with signal image for signal return path'20087,328,506'Method for forming a plated microvia interconnect'20087,240,430'Manufacturing methods for printed circuit boards'20076,986,198'Method of forming printed circuit card'20066,977,345'Vents with signal image for signal return path'20056,902,869'Manufacturing methods for printed circuit boards'20056,887,651'Electrodeposited photoresist and dry film photoresist photolithography process for printed circuit board patterning'20056,830,875'Forming a through hole in a photoimageable dielectric structure'20046,750,405'Two signal one power plane circuit board'20046,739,048'Process of fabricating a circuitized structure'20046,684,497'Manufacturing methods for printed circuit boards'20046,538,213'High density design for organic chip carriers'20036,521,844'Through hole in a photoimageable dielectric structure with wired and uncured dielectric'20036,492,600'Laminate having plated microvia interconnects and method for forming the same'20026,451,509'Composite laminate circuit structure and method of forming the same'20026,222,136'Printed circuit board with continuous connective bumps'20016,204,453'Two signal one power plane circuit board'20016,175,087'Composite laminate circuit structure and method of forming the same'20016,131,279'Integrated manufacturing packaging process'20006,027,858'Process for tenting PTH\'s with PID dry film'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2008Patents assigned to IBM (21)· patent assignee history
2000–2008Based in Endicott, NY, US· patent location history
2000–2008Based in Owego, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 21 | 2000–2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| Endicott, New York, US | 18 | 2000–2008 |
| Owego, New York, US | 3 | 2000–2008 |