Inventor
Hitoki Kanagawa
Inventor
Osaka, JP
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
G11BInformation storage based on relative movement between record carrier and transducer30%
Y10TTechnical subjects covered by former us classification15%
G02BOptical elements, systems or apparatus6%
Y02PClimate change mitigation technologies in the production or processing of goods6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
C25DProcesses for the electrolytic or electrophoretic production of coatings2%
PatentTitleYear
9,693,467'Producing method of suspension board with circuit'20179,686,869'Printed circuit board and method of manufacturing printed circuit board'20179,338,888'Wired circuit board'20168,927,870'Suspension board with circuit and producing method thereof'20158,913,348'Suspension board with circuit'20148,869,391'Producing method of wired circuit board'20148,872,036'Suspension board with circuit and producing method thereof'20148,835,767'Suspension board with circuit'20148,675,313'Suspension board with circuit'20148,618,828'Connection structure of electronic component and wired circuit board, wired circuit board assembly, and method for testing electronic component'20138,460,563'Producing method of wired circuit board'20138,450,613'Suspension board with circuit and production method thereof'20138,184,931'Suspension board with circuit'20128,174,844'Wired circuit board and connection structure between wired circuit boards'20128,146,246'Method of manufacturing a wired circuit board'20128,056,223'Method of producing a suspension board with circuit'20118,015,703'Method of manufacturing a wired circuit board'20117,957,614'Suspension board with circuit and producing method thereof'20117,925,127'Suspension board with circuit and producing method thereof'20117,732,900'Wired circuit board'20107,525,764'Suspension board with circuit'20097,471,519'Wired circuit board'20087,405,479'Wired circuit board'20087,336,446'Suspension board having a circuit and a flying lead portion'20087,307,853'Wired circuit board assembly'20077,182,606'Wired circuit board'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2017Patents assigned to NITTO DENKO CORP (25)· patent assignee history
2007–2017Based in Osaka, JP· patent location history
2009Based in Ibaraki, JP· patent location history
2011–2014Patents assigned to KANAGAWA HITOKI (9)· patent assignee history
2011–2013Patents assigned to ISHII JUN (3)· patent assignee history
2011–2012Patents assigned to NAITO TOSHIKI (2)· patent assignee history
2012–2013Patents assigned to OHSAWA TETSUYA (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 25 | 2007–2017 |
| KANAGAWA HITOKIself | 9 | 2011–2014 |
| ISHII JUN | 3 | 2011–2013 |
| OHSAWA TETSUYA | 3 | 2012–2013 |
| NAITO TOSHIKI | 2 | 2011–2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 25 | 2007–2017 |
| Ibaraki, JP | 1 | 2009 |