Inventor

Takayuki Gawazawa

Inventor

Tokyo, JP

Overview

2004–2021

Patent span

Performing operations

Primary field (CPC B)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary

B24BMachines, devices, or processes for grinding or polishing17%

B24DTools for grinding, buffing or sharpening17%

B28DWorking stone or stone-like materials17%

H01LSemiconductor devices17%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%

Y10TTechnical subjects covered by former us classification17%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2004–2021Patents assigned to DISCO CORP (2)· patent assignee history

2004–2021Based in Tokyo, JP· patent location history

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
DISCO CORP	2	2004–2021

Locations

Location	Patents	Span
Tokyo, JP	2	2004–2021