Inventor

SHANG-YUN HOU

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 85 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%

H01LSemiconductor devices31%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%

G02BOptical elements, systems or apparatus7%

H10DInorganic electric semiconductor devices4%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation2%

H04BTransmission2%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%

G01RMeasuring electric variables0%

G05FSystems for regulating electric or magnetic variables0%

PatentTitleYear

12,593,672Integrated circuit package and method2026 12,564,082Semiconductor device2026 12,564,057Chiplet interposer2026 12,557,710Semiconductor device, electronic device including the same, and manufacturing method thereof2026 12,469,821Packages with multiple types of underfill and method forming the same2025 12,442,978Photonic package and method of manufacture2025 12,400,878Integrated circuit package and method2025 12,368,132Joint structure in semiconductor package and manufacturing method thereof2025 12,362,196Package structure with underfill2025 12,334,464Encapsulated package including device dies connected via interconnect die2025 12,322,729Semiconductor device2025 12,308,343Semiconductor device and method of forming the same2025 12,294,002Integrated circuit package and method of forming same2025 12,283,541Manufacturing method of semiconductor package2025 12,259,578Photonic semiconductor device and method of manufacture2025 12,253,729Optical transceiver and manufacturing method thereof2025 12,243,824Semiconductor devices and methods of manufacture2025 12,242,108Photonic semiconductor device and method of manufacture2025 12,237,288Semiconductor die package and method of manufacture2025 12,165,992Package structure and fabricating method thereof2024 12,148,719Forming large chips through stitching2024 12,148,678Semiconductor package and manufacturing method thereof2024 12,124,078Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same2024 12,087,733Packages with multiple types of underfill and method forming the same2024 12,087,727Joint structure in semiconductor package and manufacturing method thereof2024 12,080,638Semiconductor device and method for manufacturing the same2024 12,080,681Package structure and method of fabricating the same2024 12,062,590Method for manufacturing semiconductor package structure2024 12,051,668Semiconductor package and method of forming the same2024 12,038,599Photonic package and method of manufacture2024 12,033,969Chip package structure2024 12,027,455Chip-on-wafer structure with Chiplet Interposer2024 12,015,023Integrated circuit package and method of forming same2024 12,002,721Method of fabricating semiconductor structure2024 11,996,371Chiplet interposer2024 11,990,443Semiconductor die package and method of manufacture2024 11,978,714Encapsulated package including device dies connected via interconnect die2024 11,967,546Giga interposer integration through Chip-On-Wafer-On-Substrate2024 11,916,009Semiconductor package and manufacturing method thereof2024 11,852,868Photonic semiconductor device and method of manufacture2023 11,854,983Semiconductor devices and methods of manufacture2023 11,848,304Semiconductor device and method of forming the same2023 11,830,7453D packages and methods for forming the same2023 11,810,793Semiconductor packages and methods of forming same2023 11,764,123Semiconductor package, integrated optical communication system2023 11,747,563Photonic semiconductor device and method of manufacture2023 11,728,254Giga interposer integration through chip-on-wafer-on-substrate2023 11,705,407Package structure and fabricating method thereof2023 11,699,674Semiconductor package and method of forming the same2023 11,694,939Semiconductor package, integrated optical communication system2023 11,682,593Interposer test structures and methods2023 11,630,271Package structure2023 11,592,618Photonic semiconductor device and method of manufacture2023 11,569,172Semiconductor devices and methods of manufacture2023 11,569,156Semiconductor device, electronic device including the same, and manufacturing method thereof2023 11,552,054Package structure and method of manufacturing the same2023 11,532,585Package containing device dies and interconnect die and redistribution lines2022 11,527,454Package structures and methods of forming the same2022 11,508,696Semiconductor device2022 11,502,015Semiconductor package and manufacturing method thereof2022 11,502,056Joint structure in semiconductor package and manufacturing method thereof2022 11,495,472Semicondutor packages and methods of forming same2022 11,493,689Photonic semiconductor device and method of manufacture2022 11,476,184Semiconductor device and method for manufacturing the same2022 11,462,418Integrated circuit package and method2022 11,454,773Optical transceiver and manufacturing method thereof2022 11,450,580Semiconductor structure and method of fabricating the same2022 11,444,038Forming large chips through stitching2022 11,437,334Chip package structure2022 11,428,879Method for forming a package structure for optical fiber2022 11,424,219Package structure and method of fabricating the same2022 11,417,580Package structures and methods of forming the same2022 11,415,762Optical bench, method of making and method of using2022 11,410,968Semiconductor device and method of forming the same2022 11,380,611Chip-on-wafer structure with chiplet interposer2022 11,373,946Semiconductor package and manufacturing method thereof2022 11,328,936Structure and formation method of package structure with underfill2022 11,270,956Package structure and fabricating method thereof2022 11,244,924Tri-layer CoWoS structure2022 11,222,867Package and manufacturing method thereof2022 11,201,135Three dimensional integrated circuits stacking approach2021 11,183,399Semiconductor device and method of manufacture2021 11,164,855Package structure with a heat dissipating element and method of manufacturing the same2021 11,156,772Photonic semiconductor device and method2021 11,152,312Packages with interposers and methods for forming the same2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (85)· patent assignee history

2021–2026Based in TW· patent location history

2023Patents assigned to TAIWANN SEMICONDUCTOR MFG COMPANY LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	85	2021–2026
TAIWANN SEMICONDUCTOR MFG COMPANY LTD	1	2023

Locations

Location	Patents	Span
TW	85	2021–2026