Inventor
CHING-SHENG CHU
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H10DInorganic electric semiconductor devices22%
H10HInorganic light-emitting semiconductor devices having potential barriers11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
PatentTitleYear
12,154,939High capacitance MIM device with self aligned spacer202412,132,039Mask transfer method (and related apparatus) for a bumping process202412,087,826Method for forming a semiconductor structure202411,769,791High capacitance MIM device with self aligned spacer202311,735,550Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion202311,721,683Mask transfer method (and related apparatus) for a bumping process202311,476,337Method for forming a semiconductor structure202211,264,368Mask transfer method (and related apparatus) for a bumping process202211,211,352Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2021–2024Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2021–2024 |