Inventor

Young Cheol Kim

Inventor
Yongin-si, KR

Overview

22→
Patents
1991–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 22 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
Y10TTechnical subjects covered by former us classification7%
C12NMicroorganisms or enzymes5%
G11CStatic stores5%
A61KPreparations for medical, dental or toiletry purposes2%
B01DSeparation2%
B04BCentrifuges2%
B29CShaping or joining of plastics2%
B60CVehicle tyres2%
PatentTitleYear
9,784,471'Cartridge-type inline heater and system for controlling working fluid temperature using the same'20179,012,614'Rapid nucleic acid purification using paper chromatography'20158,710,675'Integrated circuit package system with bonding lands'20148,568,588'Apparatus for osmotic power generation and desalination using salinity difference'20138,530,280'Integrated circuit package system with contoured encapsulation and method for manufacturing thereof'20138,500,331'Hybrid air foil bearing and method of manufacture'20138,471,374'Integrated circuit package system with L-shaped leadfingers'20138,067,272'Integrated circuit package system for package stacking and manufacturing method thereof'20118,012,867'Wafer level chip scale package system'20117,985,623'Integrated circuit package system with contoured encapsulation'20117,915,738'Stackable multi-chip package system with support structure'20117,856,841'Air conditioning system for automobile'20107,861,059'Method for testing and programming memory devices and system for same'20107,683,467'Integrated circuit package system employing structural support'20107,645,638'Stackable multi-chip package system with support structure'20107,622,333'Integrated circuit package system for package stacking and manufacturing method thereof'20097,435,211'Ball balancer for vertical rotor and centrifuge'20087,297,759'Peptides for increasing transfection efficiency'20076,149,420'Mold with indicia forming changeable core'20005,616,194'Pneumatic radial tire having a tread pattern'19975,315,601'Error correction method and apparatus thereof'19945,012,451'ROM circuit'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2000Patents assigned to SAMSUNG ELECTRONICS CO LTD (3)· patent assignee history
2008–2017Patents assigned to KOREA MACH & MATERIALS INST (4)· patent assignee history
2008–2017Based in Daejeon, KR· patent location history
2009–2014Patents assigned to STATS CHIPPAC LTD (10)· patent assignee history
2009–2014Based in Yongin-si, KR· patent location history
2010Based in Saratoga, CA, US· patent location history
2011–2015Patents assigned to KIM YOUNG CHEOL (5)· patent assignee history
2011–2014Patents assigned to LEE KOO HONG (3)· patent assignee history
2013Based in Daejon, KR· patent location history
2015Based in Yuseong-gu, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
STATS CHIPPAC LTD102009–2014
KIM YOUNG CHEOLself52011–2015
KOREA MACH & MATERIALS INST42008–2017
LEE KOO HONG32011–2014
SAMSUNG ELECTRONICS CO LTD31991–2000
Locations
LocationPatentsSpan
Yongin-si, KR102009–2014
Daejeon, KR42008–2017
Yuseong-gu, KR12015
Daejon, KR12013
Saratoga, California, US12010