Inventor

Arnold Kholodenko

Inventor

San Francisco, CA, US

Overview

1994–2018

Patent span

Electricity

Primary field (CPC H)

Patents· 59 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1031%

Y10TTechnical subjects covered by former us classification12%

H01JElectric discharge tubes or discharge lamps11%

C23CCoating metallic material10%

B08BCleaning in general6%

H02NElectric machines not otherwise provided for5%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%

C23FNon-mechanical removal of metallic material from surface2%

H01LSemiconductor devices2%

B01FMixing, e.g. dissolving, emulsifying or dispersing1%

PatentTitleYear

9,905,402'Plasma processing chamber with a grounded electrode assembly'2018 9,111,968'Plasma processing chamber with a grounded electrode assembly'2015 8,900,400'Proximity head having a fluid resistor'2014 8,757,177'Multi-stage substrate cleaning method and apparatus'2014 8,739,805'Confinement of foam delivered by a proximity head'2014 8,584,613'Single substrate processing head for particle removal using low viscosity fluid'2013 8,557,051'Method for using generator for foam to clean substrate'2013 8,317,966'Apparatus for substantially uniform fluid flow rates relative to a proximity head in processing of a wafer surface by a meniscus'2012 8,317,934'Multi-stage substrate cleaning method and apparatus'2012 8,313,582'System, method and apparatus for maintaining separation of liquids in a controlled meniscus'2012 8,292,697'Method for manufacturing a hybrid composite wafer carrier for wet clean equipment'2012 8,261,905'Wafer carrier drive apparatus and method for operating the same'2012 8,246,755'In situ morphological characterization of foam for a proximity head'2012 8,161,984'Generator for foam to clean substrate'2012 8,146,902'Hybrid composite wafer carrier for wet clean equipment'2012 8,141,566'System, method and apparatus for maintaining separation of liquids in a controlled meniscus'2012 7,998,304'Methods of configuring a proximity head that provides uniform fluid flow relative to a wafer'2011 7,743,730'Apparatus for an optimized plasma chamber grounded electrode assembly'2010 7,699,634'High power electrical connector for a laminated heater'2010 7,572,334'Apparatus for fabricating large-surface area polycrystalline silicon sheets for solar cell application'2009 6,908,540'Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process'2005 6,828,241'Efficient cleaning by secondary in-situ activation of etch precursor from remote plasma source'2004 6,795,292'Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber'2004 6,736,668'High temperature electrical connector'2004 6,721,162'Electrostatic chuck having composite dielectric layer and method of manufacture'2004 6,689,418'Apparatus for wafer rinse and clean and edge etching'2004 6,676,760'Process chamber having multiple gas distributors and method'2004 6,583,980'Substrate support tolerant to thermal expansion stresses'2003 6,572,814'Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas'2003 6,538,872'Electrostatic chuck having heater and method'2003 6,503,368'Substrate support having bonded sections and method'2003 6,490,145'Substrate support pedestal'2002 6,490,146'Electrostatic chuck bonded to base with a bond layer and method'2002 6,478,924'Plasma chamber support having dual electrodes'2002 6,471,822'Magnetically enhanced inductively coupled plasma reactor with magnetically confined plasma'2002 6,464,795'Substrate support member for a processing chamber'2002 6,464,790'Substrate support member'2002 6,462,928'Electrostatic chuck having improved electrical connector and method'2002 6,449,871'Semiconductor process chamber having improved gas distributor'2002 6,414,834'Dielectric covered electrostatic chuck'2002 6,320,736'Chuck having pressurized zones of heat transfer gas'2001 6,310,755'Electrostatic chuck having gas cavity and method'2001 6,278,600'Electrostatic chuck with improved temperature control and puncture resistance'2001 6,267,839'Electrostatic chuck with improved RF power distribution'2001 6,189,484'Plasma reactor having a helicon wave high density plasma source'2001 6,185,839'Semiconductor process chamber having improved gas distributor'2001 6,151,203'Connectors for an electrostatic chuck and combination thereof'2000 6,108,189'Electrostatic chuck having improved gas conduits'2000 6,095,084'High density plasma process chamber'2000 6,094,334'Polymer chuck with heater and method of manufacture'2000 6,033,478'Wafer support with improved temperature control'2000 6,015,465'Temperature control system for semiconductor process chamber'2000 5,942,039'Self-cleaning focus ring'1999 5,900,064'Plasma process chamber'1999 5,885,469'Topographical structure of an electrostatic chuck and method of fabricating same'1999 5,856,906'Backside gas quick dump apparatus for a semiconductor wafer processing system'1999 5,801,915'Electrostatic chuck having a unidirectionally conducting coupler layer'1998 5,356,158'Resilient rotary seal with projecting edge'1994 5,292,137'Rotary shaft sealing method and device'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2018Based in San Francisco, CA, US· patent location history

1998–2009Patents assigned to APPLIED MATERIALS INC (35)· patent assignee history

2010–2018Patents assigned to LAM RES CORP (19)· patent assignee history

2012–2015Patents assigned to KHOLODENKO ARNOLD (14)· patent assignee history

2012–2014Patents assigned to LIN CHENG-YU SEAN (9)· patent assignee history

2012–2014Patents assigned to HUSAIN ANWAR (5)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
APPLIED MATERIALS INC	35	1998–2009
LAM RES CORP	19	2010–2018
KHOLODENKO ARNOLDself	14	2012–2015
LIN CHENG-YU SEAN	9	2012–2014
HUSAIN ANWAR	5	2012–2014

Locations

Location	Patents	Span
San Francisco, California, US	59	1994–2018