Inventor
Puwei Liu
Inventor
San Diego, CA, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification15%
C08LCompositions of macromolecular compounds11%
C09JAdhesives11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
C07DHeterocyclic compounds8%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds8%
B22FWorking metallic powder5%
B23KSoldering or unsoldering5%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds5%
H05KPrinted circuits5%
PatentTitleYear
10,189,121Organic acid-or latent organic acid-functionalized polymer-coated metal powders for solder pastes20199,682,447'Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes'20179,427,829'Di- or poly-functional electron deficient olefins coated metal powders for solder paste'20168,835,574'Adhesive compositions for use in die attach applications'20148,698,320'Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices'20148,486,498'Thermally decomposable polymer coated metal powders'20138,338,536'Adhesive compositions for use in die attach applications'20128,278,396'Curing agents for epoxy resins'20127,973,158'Method of preparing benzoxazines'20117,851,254'B-stageable die attach adhesives'20107,550,825'Interlayer dielectric and pre-applied die attach adhesive materials'20097,517,925'Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof'20097,312,534'Interlayer dielectric and pre-applied die attach adhesive materials'20077,199,249'Free radically polymerizable coupling agents'20077,176,044'B-stageable die attach adhesives'20077,037,447'Conductive ink compositions'20066,963,001'Low shrinkage thermosetting resin compositions and methods of use therefor'20056,960,636'Thermosetting resin compositions containing maleimide and/or vinyl compounds'20056,946,523'Heterobifunctional monomers and uses therefor'20056,831,132'Film adhesives containing maleimide compounds and methods for use thereof'20046,743,852'Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2014Patents assigned to HENKEL CORP (17)· patent assignee history
2004–2014Based in San Diego, CA, US· patent location history
2009–2017Based in San Marcos, CA, US· patent location history
2011Patents assigned to HENKEL AG & CO KGAA (1)· patent assignee history
2012–2017Patents assigned to LIU PUWEI (5)· patent assignee history
2013Patents assigned to HENKEL IRELAND LTD (1)· patent assignee history
2014–2019Patents assigned to Henkel IP & Holding GmbH (4)· patent assignee history
2019Based in Glastonbury, CT, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HENKEL CORP | 17 | 2004–2014 |
| LIU PUWEIself | 5 | 2012–2017 |
| Henkel IP & Holding GmbH | 4 | 2014–2019 |
| HENKEL AG & CO KGAA | 1 | 2011 |
| HENKEL IRELAND LTD | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Diego, California, US | 12 | 2004–2014 |
| San Marcos, California, US | 8 | 2009–2017 |
| Glastonbury, CT, US | 1 | 2019 |