LexDanaLexDanabeta
Inventor

Seok-Chan Lee

Inventor
Hwaseong-si, KR

Overview

33→
Patents
2011–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 33 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
G06FElectric digital data processing15%
H04LTransmission of digital information, e.g. telegraphic communication13%
LOC1412%
G05BControl or regulating systems in general8%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes5%
H01LSemiconductor devices5%
G01RMeasuring electric variables3%
G06KGraphical data reading3%
H05KPrinted circuits3%
PatentTitleYear
10,754,522Apparatus for editing objects202010,627,792Client and server in supervisory control and data acquisition system202010,574,599Method, system and recording medium for providing contents in messenger202010,567,501Energy management server, energy management system and the method for operating the same202010,528,369SCADA system capable of efficiently configuring windows in a screen area202010,394,208Server apparatus in energy management system and operating method of thereof201910,387,005Monitoring apparatus in electric power system201910,380,055Memory card having multi-row terminals201910,277,483Apparatus for transmitting/receiving data and system comprising the same201910,243,917Method and apparatus for calculating distance in contents delivery network201910,109,259Method for displaying monitoring viewer in HMI system201810,083,165Method of controlling data display device201810,008,476Stacked semiconductor package including a smaller-area semiconductor chip20189,553,624'Card socket device and electronic apparatus including the same'20179,496,216'Semiconductor package including stacked semiconductor chips and a redistribution layer'20169,214,403'Stacked semiconductor package'2015D0736775'Memory card'2015D0736776'Memory card'2015D0735725'Memory card'2015D0730911'Memory card'2015D0730910'Memory card'2015D0730907'Memory card'2015D0730908'Memory card'20158,742,593'Electrical connection for multichip modules'20148,648,451'Semiconductor package, test socket and related methods'20148,612,613'Method for setting plurality of sessions and node using same'20138,462,511'Stacked semiconductor package'20138,349,651'Stacked package and method of manufacturing the same'20138,217,519'Electrical connection for multichip modules'20128,207,617'Electrical connections for multichip modules'20128,030,747'Stacked package and method of manufacturing the same'20117,972,902'Method of manufacturing a wafer including providing electrical conductors isolated from circuitry'20117,888,806'Electrical connections for multichip modules'2011

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2011–2019Patents assigned to SAMSUNG ELECTRONICS CO LTD (21)· patent assignee history
2011–2019Based in Seoul, KR· patent location history
2012–2016Patents assigned to LEE SEOK-CHAN (7)· patent assignee history
2012–2014Patents assigned to KIM MIN-WOO (2)· patent assignee history
2013–2019Patents assigned to CDNETWORKS CO LTD (2)· patent assignee history
2013–2019Based in Hwaseong-si, KR· patent location history
2018–2020Patents assigned to LSIS CO LTD (9)· patent assignee history
2018–2020Based in Gyeonggi-do, KR· patent location history
2019–2020Based in Anyang-si, KR· patent location history
2020Based in Seongnam-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SAMSUNG ELECTRONICS CO LTD212011–2019
LSIS CO LTD92018–2020
LEE SEOK-CHANself72012–2016
CDNETWORKS CO LTD22013–2019
KIM MIN-WOO22012–2014
Locations
LocationPatentsSpan
Hwaseong-si, KR132013–2019
Seoul, KR92011–2019
Gyeonggi-do, KR62018–2020
Anyang-si, KR32019–2020
Seongnam-si, KR12020