Inventor
POH BOON KHOO
Inventor
MY
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10BElectronic memory devices14%
G11CStatic stores5%
H05KPrinted circuits5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
PatentTitleYear
12,588,511Shielding assembly for semiconductor packages202612,575,448Integrated circuit packages with on package memory architectures202612,400,952Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge202511,908,793Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge202411,699,644Organic mold interconnects in shielded interconnects frames for integrated-circuit packages202311,658,111Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge202311,322,434Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages202211,205,613Organic mold interconnects in shielded interconnects frames for integrated-circuit packages2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to INTEL CORP (8)· patent assignee history
2021–2026Based in MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 8 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| MY | 8 | 2021–2026 |