Inventor

Ping Mei

Inventor

Palo Alto, CA, US

Overview

92→

Patents

1994–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 92 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary

H10DInorganic electric semiconductor devices10%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%

H01LSemiconductor devices8%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation7%

H05KPrinted circuits6%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%

H10KOrganic electric solid-state devices4%

B82YSpecific uses or applications of nanostructures3%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%

PatentTitleYear

11,122,683Bare die integration with printed components on flexible substrate without laser cut2021 11,107,153Interface including passive touch sensitive input device2021 10,990,869Tag system implementing a normal-on antenna and methods of use2021 10,847,384Method and fixture for chip attachment to physical objects2020 10,818,842Selective surface modification of OTFT source/drain electrode by ink jetting F4TCNQ2020 10,628,725Tag system and methods of use2020 10,571,804Method of fabricating a color filter array using a multilevel structure2020 10,490,746Selective surface modification of OTFT source/drain electrode by ink jetting F4TCNQ2019 10,466,193Printed gas sensor2019 10,427,397Structural designs for stretchable, conformal electrical interconnects2019 10,420,222Method for bonding discrete devices using anisotropic conductive film2019 10,388,874Electrochemical device with self-aligned insulation2019 10,349,528Spring loaded rollerball pen for deposition of materials on raised surfaces2019 10,229,726Memory circuit for reading ferroeletric memory having gain element including feedback capacitor2019 10,206,288Bare die integration with printed components on flexible substrate2019 10,199,586Device comprising dielectric interlayer2019 10,165,677Bare die integration with printed components on flexible substrate without laser cut2018 10,147,702Method for simultaneously bonding multiple chips of different heights on flexible substrates using anisotropic conductive film or paste2018 10,141,668Detachable flex-to-flex electrical connection2018 9,952,082Printed level sensor2018 9,947,611Through hole arrays for flexible layer interconnects2018 9,874,984Printed double-wrapped coil on paper for projective capacitance sensing2018 9,853,230Printable nanoparticle conductor ink with improved charge injection2017 9,629,252'Printed electronic components on universally patterned substrate for integrated printed electronics'2017 9,583,387'Multilevel mask circuit fabrication and multilayer circuit'2017 9,535,315'Method of fabricating a color filter array using a multilevel structure'2017 9,451,706'Protocol for assigning features and tuning resolution in digital lithography'2016 9,406,896'Pre-fabricated substrate for printed electronic devices'2016 8,877,531'Electronic apparatus'2014 8,765,252'Thin film device with minimized spatial variation of local mean height'2014 8,318,610'Method for thin film device with stranded conductor'2012 8,269,221'Structure and method for thin film device'2012 8,148,251'Forming a semiconductor device'2012 8,097,400'Method for forming an electronic device'2012 8,021,935'Thin film device fabrication process using 3D template'2011 8,013,633'Thin film transistor logic'2011 7,994,509'Structure and method for thin film device with stranded conductor'2011 7,795,062'Method of forming a pressure switch thin film device'2010 7,710,371'Variable volume between flexible structure and support surface'2010 7,678,626'Method and system for forming a thin film device'2010 7,585,424'Pattern reversal process for self aligned imprint lithography and device'2009 7,541,227'Thin film devices and methods for forming the same'2009 7,533,905'Anti-counterfeiting system and method'2009 7,521,313'Thin film device active matrix by pattern reversal process'2009 7,394,997'Anti-counterfeiting identification system and method for consumables'2008 7,341,893'Structure and method for thin film device'2008 7,338,833'Dual dielectric structure for suppressing lateral leakage current in high fill factor arrays'2008 7,304,364'Embossed mask lithography'2007 7,251,783'Large area storage display'2007 7,202,179'Method of forming at least one thin film device'2007 7,161,838'Thin film transistor memory device'2007 7,071,548'Semiconductor coated with a mixture containing an adhesion promoter'2006 7,056,834'Forming a plurality of thin-film devices using imprint lithography'2006 6,940,142'Low data line capacitance image sensor array using air-gap metal crossover'2005 6,887,792'Embossed mask lithography'2005 6,864,529'Thin film transistor memory device'2005 6,861,365'Method and system for forming a semiconductor device'2005 6,848,175'Method of forming an out-of-plane structure'2005 6,844,214'Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication'2005 6,818,535'Thin phosphorus nitride film as an n-type doping source used in a laser doping technology'2004 6,807,079'Device having a state dependent upon the state of particles dispersed in a carrier'2004 6,794,725'Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources'2004 6,762,113'Method for coating a semiconductor substrate with a mixture containing an adhesion promoter'2004 6,757,314'Structure for nitride based laser diode with growth substrate removed'2004 6,690,597'Multi-bit PROM memory cell'2004 6,653,030'Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features'2003 6,599,796'Apparatus and fabrication process to reduce crosstalk in pirm memory array'2003 6,595,787'Low cost integrated out-of-plane micro-device structures and method of making'2003 6,586,318'Thin phosphorus nitride film as an N-type doping source used in laser doping technology'2003 6,504,175'Hybrid polycrystalline and amorphous silicon structures on a shared substrate'2003 6,448,102'Method for nitride based laser diode with growth substrate removed'2002 6,384,461'Dual dielectric structure for suppressing lateral leakage current in high fill factor arrays'2002 6,365,429'Method for nitride based laser diode with growth substrate removed using an intermediate substrate'2002 6,300,648'Continuous amorphous silicon layer sensors using sealed metal back contact'2001 6,288,435'Continuous amorphous silicon layer sensors using doped poly-silicon back contact'2001 6,288,417'Light-emitting devices including polycrystalline gan layers and method of forming devices'2001 6,252,215'Hybrid sensor pixel architecture with gate line and drive line synchronization'2001 6,236,831'Method and apparatus of recycling office paper'2001 6,140,668'Silicon structures having an absorption layer'2000 6,107,641'Thin film transistor with reduced parasitic capacitance and reduced feed-through voltage'2000 6,051,827'Hybrid sensor pixel architecture with threshold response'2000 6,031,248'Hybrid sensor pixel architecture'2000 6,019,796'Method of manufacturing a thin film transistor with reduced parasitic capacitance and reduced feed-through voltage'2000 6,020,223'Method of manufacturing a thin film transistor with reduced parasitic capacitance and reduced feed-through voltage'2000 6,011,531'Methods and applications of combining pixels to the gate and data lines for 2-D imaging and display arrays'2000 6,005,238'Hybrid sensor pixel architecture with linearization circuit'1999 5,893,948'Method for forming single silicon crystals using nucleation sites'1999 5,871,826'Proximity laser doping technique for electronic materials'1999 5,821,135'Methods for and applications of making buried structures in semiconductor thin films'1998 5,767,877'Toner jet printer'1998 5,733,641'Buffered substrate for semiconductor devices'1998 5,366,926'Low temperature process for laser dehydrogenation and crystallization of amorphous silicon'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2019Patents assigned to XEROX CORP (35)· patent assignee history

1994–2017Based in Palo Alto, CA, US· patent location history

2003–2014Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (30)· patent assignee history

2012–2017Patents assigned to MEI PING (7)· patent assignee history

2014–2020Patents assigned to APPLIED MATERIALS INC (4)· patent assignee history

2014–2021Based in San Jose, CA, US· patent location history

2016–2021Patents assigned to PALO ALTO RES CT INC (25)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
XEROX CORP	35	1994–2019
HEWLETT PACKARD DEVELOPMENT CO	30	2003–2014
PALO ALTO RES CT INC	25	2016–2021
MEI PINGself	7	2012–2017
APPLIED MATERIALS INC	4	2014–2020

Locations

Location	Patents	Span
Palo Alto, California, US	63	1994–2017
San Jose, California, US	28	2014–2021