Inventor

Kei Miyoshi

Inventor

Annaka, JP

Overview

25→

Patents

1993–2013

Patent span

Chemistry

Primary field (CPC C)

Patents· 25 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Gprimary

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds22%

C08LCompositions of macromolecular compounds22%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients16%

Y10TTechnical subjects covered by former us classification9%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%

C09JAdhesives4%

H10HInorganic light-emitting semiconductor devices having potential barriers4%

C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium3%

C08JWorking-up3%

C10MLubricating compositions3%

PatentTitleYear

8,609,886'Method for producing high purity terminal olefin compound'2013 8,592,030'Silicone adhesive for semiconductor element'2013 8,119,758'Heat-conductive silicone composition and cured product thereof'2012 8,017,684'Heat conductive silicone grease compositions'2011 7,951,891'Silicone resin composition for die bonding'2011 7,838,117'Silicone-sealed LED'2010 7,786,056'Heat dissipating silicone grease compositions'2010 7,705,104'Addition curable silicon resin composition for light emitting diode'2010 7,615,387'Addition curing silicone composition capable of producing a cured product with excellent crack resistance'2009 7,595,113'LED devices and silicone resin composition therefor'2009 7,547,743'Heat conductive silicone rubber composition and molded article'2009 7,323,250'Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device'2008 6,372,860'Mother mold-forming silicone rubber composition and mother mold'2002 6,140,446'Hydrosilylation catalysts and silicone compositions using the same'2000 6,040,361'Organopolysiloxane compositions'2000 6,008,290'Mildew resistant organopolysiloxane with hydrolyzable organosilane and triazolyl compound'1999 5,900,438'Thermosetting foamable organopolysiloxane composition and process of curing the same'1999 5,561,184'Room temperature curable silicone composition'1996 5,514,741'Room temperature curable organopolysiloxane composition'1996 5,508,459'2-methyldialkoxysilyl propionic acid ester'1996 5,482,992'Room temperature quick curable organopolysiloxane composition excellent in water resistance'1996 5,371,116'Vulcanizable organopolysiloxane composition'1994 5,286,892'2-trimethoxysilylpropionate'1994 5,216,037'Room temperature vulcanizable, foamable polysiloxane composition'1993 5,196,477'Silcone compositions comprising organic compounds having the capabilities of coordination with metals'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993–2013Patents assigned to SHINETSU CHEMICAL CO (24)· patent assignee history

1993–2013Based in Annaka, JP· patent location history

1996–2009Based in Gunma, JP· patent location history

1996Based in Matsuida-machi, JP· patent location history

2012–2013Patents assigned to MIYOSHI KEI (2)· patent assignee history

2012Patents assigned to MATSUMOTO NOBUAKI (1)· patent assignee history

2013Patents assigned to ASANUMA GORO (1)· patent assignee history

2013Patents assigned to KURARAY CO (1)· patent assignee history

2013Based in Niigata, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SHINETSU CHEMICAL CO	24	1993–2013
MIYOSHI KEIself	2	2012–2013
ASANUMA GORO	1	2013
KURARAY CO	1	2013
MATSUMOTO NOBUAKI	1	2012

Locations

Location	Patents	Span
Annaka, JP	16	1993–2013
Gunma, JP	6	1996–2009
Matsuida-machi, JP	2	1996
Niigata, JP	1	2013