Inventor
Masamitsu Agari
Inventor
Tokyo, JP
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
B23KSoldering or unsoldering18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
C09JAdhesives10%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%
B24BMachines, devices, or processes for grinding or polishing3%
PatentTitleYear
11,127,633Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheet202111,069,574Wafer processing method including applying a polyester sheet to a wafer202111,062,948Wafer processing method202111,056,334Wafer processing method using a ring frame and a polyester sheet202110,847,404Sheet sticking method202010,847,420Wafer processing method202010,720,355Wafer processing method202010,438,898Wafer processing method201910,297,501Method for dividing wafer into individual chips2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019–2021Patents assigned to DISCO CORP (9)· patent assignee history
2019–2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DISCO CORP | 9 | 2019–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 9 | 2019–2021 |