Inventor
Michael A. Gaynes
Inventor
Vestal, NY, US
Overview
Patents· 149 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H05KPrinted circuits16%
Y10TTechnical subjects covered by former us classification16%
H01LSemiconductor devices5%
B23KSoldering or unsoldering3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
H01RElectrically-conductive connections2%
B29CShaping or joining of plastics2%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein2%
PatentTitleYear
10,908,110Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures202110,607,963Chip package for two-phase cooling and assembly process thereof202010,548,228Thermal interface adhesion for transfer molded electronic components202010,338,024Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures201910,249,516Underfill dispensing using funnels201910,194,522Thermal interface solution with reduced adhesion force201910,168,436Water soluble low alpha particle emission electrically-conductive coating201910,147,694Direct injection molded solder process for forming solder bumps on wafers201810,141,236Flip chip ball grid array with low impedence and grounded lid201810,043,725Flip chip ball grid array with low impedence and grounded lid20189,852,960Underfill dispensing using funnels20179,686,853'Thermal interface solution with reduced adhesion force'20179,583,410'Volumetric integrated circuit and volumetric integrated circuit manufacturing method'20179,472,789'Thin, flexible microsystem with integrated energy source'20169,343,423'No flow underfill or wafer level underfill and solder columns'20169,321,245'Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion'20169,305,896'No flow underfill or wafer level underfill and solder columns'20169,272,498'Precast thermal interface adhesive for easy and repeated, separation and remating'20169,273,408'Direct injection molded solder process for forming solder bumps on wafers'20169,181,440'Low alpha particle emission electrically-conductive coating'20159,153,460'Heatsink attachment module'20159,042,120'Grounded lid for micro-electronic assemblies'20158,963,340'No flow underfill or wafer level underfill and solder columns'20158,877,566'Curvilinear heat spreader/lid with improved heat dissipation'20148,823,164'Heatsink attachment module'20148,815,725'Low alpha particle emission electrically-conductive coating'20148,785,217'Tunable radiation source'20148,772,927'Semiconductor package structures having liquid cooler integrated with first level chip package modules'20148,693,200'Semiconductor device cooling module'20148,651,359'Flip chip bonder head for forming a uniform fillet'20148,614,900'Grounded lid for micro-electronic assemblies'20138,589,102'Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures'20138,492,910'Underfill method and chip package'20138,411,444'Thermal interface material application for integrated circuit cooling'20138,293,141'Electronic device comprising electrically stable copper filled electrically conductive adhesive'20128,288,177'SER testing for an IC chip using hot underfill'20128,268,389'Precast thermal interface adhesive for easy and repeated, separation and remating'20128,269,340'Curvilinear heat spreader/lid with improved heat dissipation'20128,129,230'Underfill method and chip package'20128,115,303'Semiconductor package structures having liquid coolers integrated with first level chip package modules'20128,037,594'Method of forming a flip-chip package'20118,026,730'Process for measuring heat spreader tilt'20118,008,122'Pressurized underfill cure'20117,808,781'Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements'20107,786,588'Composite interconnect structure using injection molded solder technique'20107,764,069'Process for measuring bond-line thickness'20107,763,188'Electrically stable copper filled electrically conductive adhesive'20107,740,713'Flux composition and techniques for use thereof'20107,645,410'Thermoplastic adhesive preform for heat sink attachment'20107,504,718'Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain'20097,489,512'Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages'20097,319,591'Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages'20087,252,515'Non-oriented wire in elastomer electrical contact'20077,238,547'Packaging integrated circuits for accelerated detection of transient particle induced soft error rates'20077,204,697'Non-oriented wire in elastomer electrical contact'20077,078,802'Method for bonding heat sinks to overmold material and resulting structure'20067,064,013'Cap attach surface modification for improved adhesion'20066,984,286'Adjusting fillet geometry to couple a heat spreader to a chip carrier'20066,981,880'Non-oriented wire in elastomer electrical contact'20066,974,915'Printed wiring board interposer sub-assembly and method'20056,949,415'Module with adhesively attached heat sink'20056,892,451'Method of making an interposer sub-assembly in a printed wiring board'20056,893,591'Thermoplastic adhesive preform for heat sink attachment'20056,893,523'Method for bonding heat sinks to overmold material'20056,835,441'Bonding together surfaces'20046,803,256'Cap attach surface modification for improved adhesion'20046,777,817'Reworkable and thermally conductive adhesive and use thereof'20046,770,968'Method for bonding heat sinks to overmolds and device formed thereby'20046,744,132'Module with adhesively attached heat sink'20046,740,959'EMI shielding for semiconductor chip carriers'20046,739,046'Method for producing dendrite interconnect for planarization'20046,719,871'Method for bonding heat sinks to overmolds and device formed thereby'20046,695,623'Enhanced electrical/mechanical connection for electronic devices'20046,670,223'Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses'20036,661,661'Common heatsink for multiple chips and modules'20036,617,698'Reworkable and thermally conductive adhesive and use thereof'20036,576,996'Method for bonding heat sinks to overmolds and device formed thereby'20036,559,666'Method and device for semiconductor testing using electrically conductive adhesives'20036,545,226'Printed wiring board interposer sub-assembly'20036,545,869'Adjusting fillet geometry to couple a heat spreader to a chip carrier'20036,531,343'Method of encapsulating a circuit assembly'20036,517,662'Process for making semiconductor chip assembly'20036,512,295'Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses'20036,495,771'Compliant multi-layered circuit board for PBGA applications'20026,492,724'Structure for reinforcing a semiconductor device to prevent cracking'20026,487,461'TFT panel alignment and attachment method and apparatus'20026,447,885'Bonding together surfaces'20026,432,511'Thermoplastic adhesive preform for heat sink attachment'20026,427,323'Method for producing conductor interconnect with dendrites'20026,410,988'Thermally enhanced and mechanically balanced flip chip package and method of forming'20026,403,882'Protective cover plate for flip chip assembly backside'20026,369,452'Cap attach surface modification for improved adhesion'20026,344,099'TFT panel alignment and attachment method and apparatus'20026,326,237'Reworkable thermoplastic hyper-branched encapsulant'20016,300,575'Conductor interconnect with dendrites through film'20016,288,559'Semiconductor testing using electrically conductive adhesives'20016,268,739'Method and device for semiconductor testing using electrically conductive adhesives'20016,256,874'Conductor interconnect with dendrites through film and method for producing same'20016,255,208'Selective wafer-level testing and burn-in'20016,251,707'Attaching heat sinks directly to flip chips and ceramic chip carriers'20016,252,779'Ball grid array via structure'20016,236,115'High density integrated circuit packaging with chip stacking and via interconnections'20016,219,238'Structure for removably attaching a heat sink to surface mount packages'20016,206,997'Method for bonding heat sinks to overmolds and device formed thereby'20016,199,751'Polymer with transient liquid phase bondable particles'20016,197,619'Method for reinforcing a semiconductor device to prevent cracking'20016,197,222'Lead free conductive composites for electrical interconnections'20016,193,576'TFT panel alignment and attachment method and apparatus'20016,187,678'High density integrated circuit packaging with chip stacking and via interconnections'20016,174,406'Bonding together surfaces'20016,165,885'Method of making components with solder balls'20006,150,726'Component carrier with raised bonding sites'20006,129,804'TFT panel alignment and attachment method and apparatus'20006,111,323'Reworkable thermoplastic encapsulant'20006,104,093'Thermally enhanced and mechanically balanced flip chip package and method of forming'20006,087,021'Polymer with transient liquid phase bondable particles'20006,069,023'Attaching heat sinks directly to flip chips and ceramic chip carriers'20006,043,110'Wire mesh insert for thermal adhesives'20006,002,177'High density integrated circuit packaging with chip stacking and via interconnections'19995,998,876'Reworkable thermoplastic hyper-branched encapsulant'19995,980,348'TFT panel alignment and attachment method and apparatus'19995,977,642'Dendrite interconnect for planarization and method for producing same'19995,973,389'Semiconductor chip carrier assembly'19995,969,945'Electronic package assembly'19995,960,251'Organic-metallic composite coating for copper surface protection'19995,940,687'Wire mesh insert for thermal adhesives'19995,910,641'Selectively filled adhesives for compliant, reworkable, and solder-free flip chip interconnection and encapsulation'19995,889,321'Stiffeners with improved adhesion to flexible substrates'19995,875,011'Liquid crystal display tile interconnected to a tile carrier and method'19995,875,010'Display panel having individual display devices bonded to light transmitting plates which have a combined area greater than of the devices'19995,866,044'Lead free conductive composites for electrical interconnections'19995,847,929'Attaching heat sinks directly to flip chips and ceramic chip carriers'19985,831,828'Flexible circuit board and common heat spreader assembly'19985,813,870'Selectively filled adhesives for semiconductor chip interconnection and encapsulation'19985,798,050'Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate'19985,785,799'Apparatus for attaching heat sinks directly to chip carrier modules using flexible epoxy'19985,777,705'Wire bond attachment of a liquid crystal display tile to a tile carrier'19985,759,269'Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture'19985,759,737'Method of making a component carrier'19985,747,101'Direct chip attachment (DCA) with electrically conductive adhesives'19985,744,863'Chip carrier modules with heat sinks attached by flexible-epoxy'19985,713,508'Stabilization of conductive adhesive by metallurgical bonding'19985,672,548'Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy'19975,638,597'Manufacturing flexible circuit board assemblies with common heat spreaders'19975,565,033'Pressurized injection nozzle for screening paste'19965,545,465'Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits'19965,543,585'Direct chip attachment (DCA) with electrically conductive adhesives'19965,542,602'Stabilization of conductive adhesive by metallurgical bonding'19965,478,700'Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–2021Patents assigned to IBM (144)· patent assignee history
1995–2021Based in Vestal, NY, US· patent location history
1996–2003Based in Broome, NY, US· patent location history
2012–2016Patents assigned to GAYNES MICHAEL A (14)· patent assignee history
2012–2014Patents assigned to GAYNES MICHAEL (4)· patent assignee history
2012–2014Based in Yorktown Heights, NY, US· patent location history
2014–2016Patents assigned to NAH JAE-WOONG (4)· patent assignee history
2015–2019Based in Armonk, NY, US· patent location history
2016–2018Patents assigned to GLOBALFOUNDRIES INC (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 144 | 1995–2021 |
| GAYNES MICHAEL Aself | 14 | 2012–2016 |
| GAYNES MICHAELself | 4 | 2012–2014 |
| GLOBALFOUNDRIES INC | 4 | 2016–2018 |
| NAH JAE-WOONG | 4 | 2014–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Vestal, New York, US | 134 | 1995–2021 |
| Armonk, New York, US | 7 | 2015–2019 |
| Yorktown Heights, New York, US | 4 | 2012–2014 |
| Broome, New York, US | 4 | 1996–2003 |