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Inventor

Zhengguo Wen

Inventor
Dongguan, CN

Overview

2→
Patents
2020–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices40%
B24BMachines, devices, or processes for grinding or polishing20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
PatentTitleYear
11,088,053Encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same202110,556,314Head height adjustment device and substrate processing apparatus provided with head height adjustment device2020

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2020Patents assigned to EBARA CORP (1)· patent assignee history
2020Based in Tokyo, JP· patent location history
2021Patents assigned to GUANGDONG CHIPPACKING TECH CO LTD (1)· patent assignee history
2021Based in Dongguan, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA CORP12020
GUANGDONG CHIPPACKING TECH CO LTD12021
Locations
LocationPatentsSpan
Dongguan, CN12021
Tokyo, JP12020