Inventor
Jia-lin WEI
Inventor
TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices30%
H01LSemiconductor devices30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
C23CCoating metallic material11%
PatentTitleYear
12,463,034Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern202512,271,113Method of manufacturing a semiconductor device202512,272,554Method of manufacturing a semiconductor device202512,135,501Method of manufacturing a semiconductor device202412,057,315Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern202411,822,237Method of manufacturing a semiconductor device202311,784,046Method of manufacturing a semiconductor device202311,705,332Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (8)· patent assignee history
2023–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 8 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 8 | 2023–2025 |