Inventor
SWEE KAH LEE
Inventor
MY
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems6%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure6%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
B23KSoldering or unsoldering3%
H05KPrinted circuits3%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
12,550,751Flip chip bonding for semiconductor packages using metal strip202612,232,302Dipped coated electronic module assembly with enhanced thermal distribution202512,218,038Leadframe, semiconductor package and method202512,176,222Semiconductor package with metal posts from structured leadframe202411,791,169Dual step laser processing of an encapsulant of a semiconductor chip package202311,682,644Semiconductor device with a heterogeneous solder joint and method for fabricating the same202311,469,161Lead frame-based semiconductor package202211,302,613Double-sided cooled molded semiconductor package202211,289,436Semiconductor package having a laser-activatable mold compound202211,274,984Pressure sensor having a lidless/laminate structure202211,174,152Over-under sensor packaging with sensor spaced apart from control chip2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to INFINEON TECHNOLOGIES AG (8)· patent assignee history
2021–2026Based in MY· patent location history
2022–2025Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 8 | 2021–2026 |
| INFINEON TECHNOLOGIES AUSTRIA AG | 3 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| MY | 11 | 2021–2026 |