Inventor
HUIMING BU
Inventor
US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices29%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
B82YSpecific uses or applications of nanostructures11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
G01RMeasuring electric variables4%
PatentTitleYear
12,593,468Self-aligned backside contact with increased contact area202612,550,359Forming a sacrificial liner for dual channel devices202612,422,465In-situ chip design for pulse IV self-heating evaluation202512,268,031Backside power rails and power distribution network for density scaling202512,166,042Stacked nanosheet gate-all-around device structures202411,894,462Forming a sacrificial liner for dual channel devices202411,329,136Enabling anneal for reliability improvement and multi-Vt with interfacial layer regrowth suppression202211,189,729Forming a sacrificial liner for dual channel devices202111,139,385Interface-less contacts to source/drain regions and gate electrode over active portion of device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to IBM (6)· patent assignee history
2021Patents assigned to TESSERA INC (1)· patent assignee history
2021–2026Based in US· patent location history
2024–2026Patents assigned to ADEIA SEMICONDUCTOR SOLUTIONS LLC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 6 | 2021–2026 |
| ADEIA SEMICONDUCTOR SOLUTIONS LLC | 2 | 2024–2026 |
| TESSERA INC | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 9 | 2021–2026 |