Inventor

Yao-Te Huang

Inventor
Hsinchu, TW

Overview

37→
Patents
2009–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 37 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices12%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems12%
H01LSemiconductor devices7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock5%
H02KDynamo-electric machines5%
H02NElectric machines not otherwise provided for5%
H10DInorganic electric semiconductor devices5%
Y10TTechnical subjects covered by former us classification5%
B29CShaping or joining of plastics3%
PatentTitleYear
11,050,440Encoder, decoder, encoding method and decoding method based on low-density parity-check code202111,031,286Conductive feature formation and structure202111,031,533Light-emitting device, light-emitting module, and backlight module202110,785,158System and method for provisioning both IPV4 and IPV6 internet service and load balancer service202010,779,100Method for manufacturing a microphone202010,343,391Three-dimensional printing apparatus and three-dimensional printing method201910,273,148Micro-electro-mechanical system and manufacturing method thereof201910,266,390Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring201910,252,464Slicing printing method for color 3D model20199,998,843Method for manufacturing a microphone20189,981,427Sensing device for three-dimensional printing object20189,718,239'Three dimensional printing apparatus and three dimensional printing method'20179,673,169'Method and apparatus for a wafer seal ring'20179,584,003'Energy-harvesting device'20179,545,691'Method of removing waste of substrate and waste removing device thereof'20179,462,402'Monolithic complementary metal-oxide semiconductor (CMOS)-integrated silicon microphone'20169,269,679'Wafer level packaging techniques'20169,264,833'Structure and method for integrated microphone'20169,246,401'Energy-harvesting device and method of forming the same'20169,181,083'MEMS devices and methods of forming the same'20159,034,677'MEMS device and method of formation thereof'20158,952,626'Lighting control systems and methods'20158,928,162'Sensor with energy-harvesting device'20158,853,801'MEMS devices and methods of forming the same'20148,841,201'Systems and methods for post-bonding wafer edge seal'20148,763,220'Method of manufacturing a MEMS device'20148,749,165'Light source driving device including a switching current adjustment circuit'20148,735,260'Method to prevent metal pad damage in wafer level package'20148,723,343'Sensor with energy-harvesting device'20148,722,537'Multi-sacrificial layer and method'20148,686,571'Bonding layer structure and method for wafer to wafer bonding'20148,580,594'Method of fabricating a semiconductor device having recessed bonding site'20138,410,665'MEMS kinetic energy conversion'20138,377,798'Method and structure for wafer to wafer bonding in semiconductor packaging'20138,242,757'Constant power control apparatus and control method thereof'20128,111,009'Light adjustment circuit for alternating-current light emitting diodes (AC-LED\'s)'20127,513,588'Apparatus and method for supplying voltage to nozzle in inkjet printer'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2020Based in Taoyuan, TW· patent location history
2012–2015Patents assigned to HUANG YAO-TE (12)· patent assignee history
2012–2015Based in Changhua County, TW· patent location history
2013–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (15)· patent assignee history
2013–2014Patents assigned to HUANG HSIN-TING (6)· patent assignee history
2013–2014Patents assigned to TSAI SHANG-YING (6)· patent assignee history
2013–2020Based in Hsinchu, TW· patent location history
2016–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (10)· patent assignee history
2017–2019Based in New Taipei, TW· patent location history
2021Based in Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG152013–2016
HUANG YAO-TEself122012–2015
TAIWAN SEMICONDUCTOR MFG CO LTD102016–2021
HUANG HSIN-TING62013–2014
TSAI SHANG-YING62013–2014
Locations
LocationPatentsSpan
Hsinchu, TW242013–2020
New Taipei, TW42017–2019
Changhua County, TW42012–2015
Taoyuan, TW22009–2020
Taipei, TW12021