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Inventor

TOSHIFUMI KIMBA

Inventor
JP

Overview

4→
Patents
2022–2024
Patent span
Physics
Primary field (CPC G)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing27%
G01BMeasuring length, thickness or similar linear dimensions27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
G01NInvestigating or analysing materials by determining their chemical or physical properties13%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light7%
H01LSemiconductor devices7%
PatentTitleYear
11,951,588Optical film-thickness measuring apparatus and polishing apparatus202411,911,867Polishing apparatus and polishing method202411,612,982Polishing method and polishing apparatus202311,413,720Polishing apparatus2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2024Patents assigned to EBARA CORP (4)· patent assignee history
2022–2024Based in JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA CORP42022–2024
Locations
LocationPatentsSpan
JP42022–2024