Inventor

CHERNG-YUH SU

Inventor

Overview

2→

Patents

2023

Patent span

Performing operations

Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Bprimary

B29BPreparation or pretreatment of the material to be shaped9%

B29CShaping or joining of plastics9%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts9%

B29LIndexing scheme associated with subclass b29c, relating to particular articles9%

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering9%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds9%

C08JWorking-up9%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients9%

C08LCompositions of macromolecular compounds9%

F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact9%

PatentTitleYear

11,835,299Thin vapor-chamber structure2023 11,642,840Composite material layer and method for manufacturing the same2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023Patents assigned to DELTA ELECTRONICS INC (1)· patent assignee history

2023Patents assigned to UNIV NAT TAIPEI TECHNOLOGY (1)· patent assignee history

2023Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
DELTA ELECTRONICS INC	1	2023
UNIV NAT TAIPEI TECHNOLOGY	1	2023

Locations

Location	Patents	Span
TW	2	2023