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Inventor

Shogo Asai

Inventor
Shiga, JP

Overview

1→
Patents
2019
Patent span
Chemistry
Primary field (CPC C)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B32Bprimary
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form17%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds17%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients17%
C08LCompositions of macromolecular compounds17%
C09JAdhesives17%
H05KPrinted circuits17%
PatentTitleYear
10,244,626Adhesive composition for printed wiring boards, bonding film, coverlay, copper-clad laminate and printed wiring board2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (1)· patent assignee history
2019Patents assigned to SUMITOMO ELECTRIC PRINTED CIRCUITS INC (1)· patent assignee history
2019Based in Shiga, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SUMITOMO ELECTRIC INDUSTRIES12019
SUMITOMO ELECTRIC PRINTED CIRCUITS INC12019
Locations
LocationPatentsSpan
Shiga, JP12019