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Inventor

Maki Asada

Inventor
Kiyosu, JP

Overview

3→
Patents
2017–2021
Patent span
Chemistry
Primary field (CPC C)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C09Gprimary
C09GPolishing compositions19%
C09KMaterials for miscellaneous applications, not provided for elsewhere19%
H01LSemiconductor devices19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
B24BMachines, devices, or processes for grinding or polishing13%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients6%
C08LCompositions of macromolecular compounds6%
PatentTitleYear
11,130,883Polishing composition20219,685,341'Abrasive composition and method for producing semiconductor substrate'20179,650,544'Polishing composition, method for manufacturing polishing composition, and method for manufacturing polishing composition liquid concentrate'2017

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017–2021Patents assigned to FUJIMI INC (3)· patent assignee history
2017–2021Based in Kiyosu, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FUJIMI INC32017–2021
Locations
LocationPatentsSpan
Kiyosu, JP32017–2021