Inventor
Hideki Katayama
Inventor
Okayama, JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C01Gprimary
C01GCompounds containing metals not covered by subclasses c01d or c01f20%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds20%
H01FMagnets20%
B65BMachines, apparatus or devices for, or methods of, packaging articles or materials10%
C04BLime, magnesia10%
C09CTreatment of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties10%
Y10TTechnical subjects covered by former us classification10%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998Patents assigned to MOLEX INC (1)· patent assignee history
1998Based in Toyama, JP· patent location history
2008–2016Patents assigned to DOWA ELECTRONICS MATERIALS CO LTD (2)· patent assignee history
2008Patents assigned to NIPPON BENGARA KOGYO CO LTD (1)· patent assignee history
2008Based in Tsuyama, JP· patent location history
2016Patents assigned to DOWA F-TEC CO LTD (1)· patent assignee history
2016Based in Okayama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DOWA ELECTRONICS MATERIALS CO LTD | 2 | 2008–2016 |
| DOWA F-TEC CO LTD | 1 | 2016 |
| MOLEX INC | 1 | 1998 |
| NIPPON BENGARA KOGYO CO LTD | 1 | 2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| Okayama, JP | 1 | 2016 |
| Tsuyama, JP | 1 | 2008 |
| Toyama, JP | 1 | 1998 |