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Inventor

William Dyson, Jr.

Inventor
San Jose, CA, US

Overview

5→
Patents
1999–2006
Patent span
Performing operations
Primary field (CPC B)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing33%
B08BCleaning in general22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests22%
PatentTitleYear
7,044,838'Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring'20066,309,290'Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control'20016,231,428'Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring'20016,059,889'Method for processing a substrate using a system having a roller with treading'20005,862,560'Roller with treading and system including the same'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2000Patents assigned to ONTRAK SYSTEMS INC (2)· patent assignee history
1999–2006Based in San Jose, CA, US· patent location history
2001Patents assigned to MITSUBISHI MATERIALS CORP (2)· patent assignee history
2006Patents assigned to EBARA CORP (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MITSUBISHI MATERIALS CORP22001
ONTRAK SYSTEMS INC21999–2000
EBARA CORP12006
Locations
LocationPatentsSpan
San Jose, California, US51999–2006